Journal: Scientific Reports

Article Title: Metasurface sensing difference in waveforms at the same frequency with reduced power level

doi: 10.1038/s41598-020-71242-0

Figure Lengend Snippet: ( a ) Electromagnetic model, ( b ) circuit schematic diagram and ( c ) equivalent electromagnetic structure. Additional circuit components deployed inside a diode bridge. Design parameters are given in Table , and PRC is seen in Fig. a.

Article Snippet: This structure was numerically tested by using a co-simulation method integrating an electromagnetic simulator with a circuit simulator (ANSYS Electronics Desktop R18.1.0) .

Techniques:

Journal: Micromachines

Article Title: Design of Power Amplifiers for BDS-3 Terminal Based on InGaP/GaAs HBT MMIC and LGA Technology

doi: 10.3390/mi14111995

Figure Lengend Snippet: 3 W/5 W PA chip compatibility optimization design platform.

Article Snippet: The total chip size is only 6 × 4 × 1 mm 3 with good thermal characteristics, and its integration level exceeds similar PA products; The proposed PA chip integrates a temperature-insensitive adaptive power detection circuit module and ESD (Electro-Static Discharge) electrostatic protection circuits without affecting the electromagnetic performance, thermal performance, or size, compared with a similar PA design [ ]; the PA chip proposed in this paper is more complete and reliable, which provides a strong guarantee for the accurate power monitoring and controlling of terminals as well as its yield rate; A class-F output matching circuit co-simulation design platform, a 3 W and 5 W PA compatibility design platform both based on ADS (Advanced Design System) and HFSS (High-Frequency Simulator Structure), and a thermal simulation auxiliary design platform based on ANSYS are proposed, which can all be used to improve the design and optimization efficiency of similar PA products.

Techniques: